Document :

ITU-T�SG 5� (Study Period 2013)� Temporary Document� 376-GEN

Title :

K.77 Appendix I Characterizing thermally protected MOVs using a.c. step stress testing

Date :

2013-12-09

Source :

Rapporteur Q2/5

AI/Question :

Q2/5

Access :

Restricted to TIES users�[ITU-T]