Documento :

UIT-T�SG 15� (Periodo de estudios 2017)� Contribuci�n� 1037

T�tulo :

Proposal of new work Item for SCL layer network of Slicing Packet Network

Recibido en :

2018-09-25

Origen :

Broadcom Corporation (United States) , China Mobile Communications Corporation , FiberHome Technologies Group (China) , Huawei Technologies Co., Ltd. (China) , Microsemi Corporation (United States) , Ministry of Industry and Information Technology (MIIT) (China) , Telef�nica S.A. (Spain) , Viavi Solutions Deutschland GmbH (Germany) , Xilinx Incorporation (United States) , ZTE Corporation (China)

AI/Cuesti�n :

Q11/15

Reuni�n :

2018-10-08

Disponibilidad :

Restringido a usuarios de TIES�[UIT-T]