Documento :

UIT-T�SG 15� (Periodo de estudios 2017)� Contribuci�n� 664

T�tulo :

The projects proposal of Slicing Channel Layer of Slicing Packet Network(SPN)

Recibido en :

2018-01-16

Origen :

Broadcom Corporation , China Mobile Communications Corporation , EXFO Inc. , FiberHome Technologies Group , Huawei Technologies Co., Ltd. , Microsemi Corporation , Ministry of Industry and Information Technology (MIIT) , Telefon AB - LM Ericsson , Telef�nica S.A. , Viavi Solutions Deutschland GmbH , ZTE Corporation

AI/Cuesti�n :

Q10/15, Q11/15, Q12/15, Q14/15, Q9/15

Reuni�n :

2018-01-29

Disponibilidad :

Restringido a usuarios de TIES�[UIT-T]