Document :

ITU-T�SG 5� (Study Period 2017)� Contribution� 701

Title :

Potential environmental impact savings by lean packaging concepts

Date :

2020-10-03

Source :

Colegio Oficial de Ingenieros de Telecomunicaci�n (COIT) (Spain) , Huawei Technologies Co., Ltd. (China)

AI/Question :

Q7/5

Meeting :

2020-10-19

Access :

Restricted to TIES users�[ITU-T]