[23-GEN]� Study Plan for Question 3/6 (Technical aspects related to the unbundling and sharing of outside plant elements in copper and optical networks)

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[23-GEN]� Study Plan for Question 3/6 (Technical aspects related to the unbundling and sharing of outside plant elements in copper and optical networks)

	Formato	Tama�o	Puesta a disposici�n

English	Word �	40448 octetos	2005-01-21	[23-GEN]�

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Documento :	UIT-T�SG06� (Periodo de estudios 2005)� Documento Temporale� 23-GEN
T�tulo :	Study Plan for Question 3/6 (Technical aspects related to the unbundling and sharing of outside plant elements in copper and optical networks)
Recibido en :	2005-01-21
Origen :	Q3/6 Rapporteur
AI/Cuesti�n :	Q3/6
Disponibilidad :	Restringido a usuarios de TIES�[UIT-T]

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Contacto p�blico :� TSB EDH
Actualizado el :�2005-01-28

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