|
Work item:
|
L.liquid_DC
|
|
Subject/title:
|
High Efficiency Liquid Cooling Solutions and Practices for Data Centres
|
|
Status:
|
Under study [Issued from previous study period]
|
|
Approval process:
|
AAP
|
|
Type of work item:
|
Recommendation
|
|
Version:
|
New
|
|
Equivalent number:
|
-
|
|
Timing:
|
2026 (Medium priority)
|
|
Liaison:
|
-
|
|
Supporting members:
|
China Telecommunications Corporation, Communications Authority of Kenya, China Unicom, Colombia
|
|
Summary:
|
The traditional air-cooling model is becoming limited in heat transfer performance and energy optimisation, while liquid-cooling technology, as a highly efficient and green cooling method, is gradually becoming the first choice for data centre construction. Compared with air-cooling, liquid-cooling technology can better support high power consumption chip cooling, support higher density of cabinets, and enhance the adaptability of data centre environment. Therefore, the application of liquid cooling technology in future data centre construction will be an important part in the direction of data centre cooling, and an important initiative to achieve green computing power and carbon neutrality goals.
Currently, cold plate liquid cooling and immersion liquid cooling have become the mainstream technology for data centre applications.
Due to the advantages of higher industrial chain maturity, relatively low cost, and simpler maintenance, cold plate liquid cooling has become a more widely used technology route for data centre computing business. However, there is also a lack of standardisation in the application process, how to transition from air cooling to liquid cooling solutions, and how to cooperate with each other during the coexistence of air cooling and liquid cooling and a series of issues that need to be resolved.
|
|
Comment:
|
-
|
|
Reference(s):
|
|
|
Historic references:
|
|
Contact(s):
|
|
| ITU-T A.5 justification(s): |
|
|
|
|
First registration in the WP:
2024-07-03 15:15:00
|
|
Last update:
2024-07-03 16:31:11
|
|
